18945399. HEAT DISSIPATION ASSEMBLY (DELTA ELECTRONICS, INC.)
HEAT DISSIPATION ASSEMBLY
Organization Name
Inventor(s)
Chin-Ting Chen of Taoyuan City (TW)
Chih-Wei Yang of Taoyuan City (TW)
Shu-Cheng Yang of Taoyuan City (TW)
Che-Wei Chang of Taoyuan City (TW)
Wen-Cheng Huang of Taoyuan City (TW)
Chin-Hung Lee of Taoyuan City (TW)
Chih-Wei Chan of Taoyuan City (TW)
HEAT DISSIPATION ASSEMBLY
This abstract first appeared for US patent application 18945399 titled 'HEAT DISSIPATION ASSEMBLY
Original Abstract Submitted
A heat dissipation assembly is disclosed and includes a fan, a vapor chamber and a heat dissipation fin set. The fan includes a fan frame, an impeller and a fan cover. The impeller is disposed on the fan frame and accommodated in an accommodation space. The impeller includes plural metal blades and a hub, and the plural metal blades are radially arranged on the periphery of the hub to form a dense-metal-blade impeller. The fan cover is assembled with the fan frame to form an outlet, and the fan cover includes an inlet. The vapor chamber includes an upper plate and a lower plate assembled with each other. The upper plate or the lower plate is connected to the fan cover, and the vapor chamber and the fan cover are coplanar. The heat dissipation fin set is connected to the lower plate and spatially corresponding to the outlet.