STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wei-Yu Chen of Taipei City (TW)

Cheng-Shiuan Wong of Hsinchu (TW)

Chia-Shen Cheng of Hsinchu (TW)

Hsuan-Ting Kuo of Taichung City (TW)

Hao-Jan Pei of Hsinchu (TW)

Hsiu-Jen Lin of Zhubei City (TW)

Mao-Yen Chang of Kaohsiung City (TW)

STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE

This abstract first appeared for US patent application 18405844 titled 'STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE

Original Abstract Submitted

A semiconductor package includes an interposer that has a first side and a second side opposing the first side. A semiconductor device that is on the first side of the interposer and an optical device that is on the first side of the interposer and next to the semiconductor device. A first encapsulant layer includes a first portion and a second portion. The first portion of the first encapsulant layer is on the first side of the interposer and along sidewalls of the semiconductor device. A gap is between a first sidewall of the optical device and a second sidewall of the first portion of the first encapsulant layer. A substrate is over the second side of the interposer. The semiconductor device and the optical device are electrically coupled to the substrate through the interposer.