US Patent Application 18154945. SEMICONDUCTOR DIE FOR CONTROLLING ON-DIE-TERMINATION OF ANOTHER SEMICONDUCTOR DIE, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME simplified abstract

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SEMICONDUCTOR DIE FOR CONTROLLING ON-DIE-TERMINATION OF ANOTHER SEMICONDUCTOR DIE, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.


Inventor(s)

TAEYOUNG Oh of Suwon-si (KR)


SEMICONDUCTOR DIE FOR CONTROLLING ON-DIE-TERMINATION OF ANOTHER SEMICONDUCTOR DIE, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME - A simplified explanation of the abstract

  • This abstract for appeared for US patent application number 18154945 Titled 'SEMICONDUCTOR DIE FOR CONTROLLING ON-DIE-TERMINATION OF ANOTHER SEMICONDUCTOR DIE, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME'

Simplified Explanation

The abstract describes a semiconductor die that has two pins. The first pin is used to send a control signal to another semiconductor die, which has multiple circuits that respond to this control signal. The second pin is used to receive a control signal from the second semiconductor die, which has multiple circuits that respond to this control signal as well. In simpler terms, the semiconductor die has two pins for communication with another die, each controlling different circuits.


Original Abstract Submitted

A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.