Texas instruments incorporated (20240113413). MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
Organization Name
texas instruments incorporated
Inventor(s)
Rajen Manicon Murugan of Dallas TX (US)
Juan Alejandro Herbsommer of Allen TX (US)
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113413 titled 'MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes a patent application for an antenna formed on a multilayer package substrate with a semiconductor die mounted on the same substrate.
- The antenna is formed in a first conductor layer on the device side surface of the multilayer package substrate.
- The multilayer package substrate includes conductor layers separated by dielectric material and connected by conductive vertical connection layers.
- The semiconductor die is mounted on the device side surface of the substrate, spaced from and coupled to the antenna.
Potential Applications
This technology could be applied in:
- Wireless communication devices
- IoT devices
- RFID systems
Problems Solved
- Space-saving design by integrating the antenna with the substrate
- Improved signal transmission and reception due to close proximity of the antenna to the semiconductor die
Benefits
- Enhanced performance of wireless devices
- Cost-effective manufacturing process
- Compact and efficient design
Potential Commercial Applications
- Mobile phones
- Smart home devices
- Wearable technology
Possible Prior Art
One possible prior art could be the integration of antennas on PCBs in electronic devices.
Unanswered Questions
How does the integration of the antenna on the multilayer package substrate impact the overall size of the device?
The abstract does not provide information on whether the integration of the antenna on the substrate reduces the overall size of the device or if it requires additional space.
What materials are used in the construction of the multilayer package substrate to ensure optimal performance of the antenna?
The abstract does not specify the materials used in the construction of the substrate and how they affect the performance of the antenna.
Original Abstract Submitted
a described example includes an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.
