Difference between revisions of "Texas Instruments Incorporated patent applications published on April 11th, 2024"
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| + | '''Summary of the patent applications from Texas Instruments Incorporated on April 11th, 2024''' | ||
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| + | Texas Instruments Incorporated has recently filed patents for innovative technologies in the fields of device synchronization, video decoding, communication systems, and package substrates for integrated circuits. These patents cover methods and systems for synchronizing devices using access address generation, video decoding with edge type determination and filtering, decision feedback equalizers for communication systems, and package substrates with multiple metal layers for improved electrical connectivity. | ||
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| + | Summary of notable applications: | ||
| + | * Wireless communication systems | ||
| + | * IoT devices | ||
| + | * Network security protocols | ||
| + | * Video decoding systems | ||
| + | * Image processing software | ||
| + | * Multimedia applications | ||
| + | * Communication systems | ||
| + | * Semiconductor industry | ||
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| + | Benefits of these technologies include enhanced security, improved data transmission reliability, efficient processing of communication symbols, and increased efficiency in electronic devices. These innovations address key challenges in device synchronization, video decoding efficiency, signal quality in communication systems, and electrical connectivity in integrated circuits. | ||
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==Patent applications for Texas Instruments Incorporated on April 11th, 2024== | ==Patent applications for Texas Instruments Incorporated on April 11th, 2024== | ||
Latest revision as of 11:04, 16 April 2024
Summary of the patent applications from Texas Instruments Incorporated on April 11th, 2024
Texas Instruments Incorporated has recently filed patents for innovative technologies in the fields of device synchronization, video decoding, communication systems, and package substrates for integrated circuits. These patents cover methods and systems for synchronizing devices using access address generation, video decoding with edge type determination and filtering, decision feedback equalizers for communication systems, and package substrates with multiple metal layers for improved electrical connectivity.
Summary of notable applications:
- Wireless communication systems
- IoT devices
- Network security protocols
- Video decoding systems
- Image processing software
- Multimedia applications
- Communication systems
- Semiconductor industry
Benefits of these technologies include enhanced security, improved data transmission reliability, efficient processing of communication symbols, and increased efficiency in electronic devices. These innovations address key challenges in device synchronization, video decoding efficiency, signal quality in communication systems, and electrical connectivity in integrated circuits.
Contents
- 1 Patent applications for Texas Instruments Incorporated on April 11th, 2024
- 1.1 METHODS AND APPARATUS TO COMPARE VOLTAGES (17962139)
- 1.2 AT-SPEED TEST OF FUNCTIONAL MEMORY INTERFACE LOGIC IN DEVICES (18392740)
- 1.3 HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS (18527618)
- 1.4 MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR DEVICE (17958254)
- 1.5 STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM (17960871)
- 1.6 STANDALONE ISOLATION CAPACITOR (18390395)
- 1.7 REDUCED ESR IN TRENCH CAPACITOR (18543769)
- 1.8 MONOLITHIC INTEGRATION OF HIGH AND LOW-SIDE GAN FETS WITH SCREENING BACK GATING EFFECT (18543738)
- 1.9 INTEGRATED BATTERY CHARGE REGULATION CIRCUIT BASED ON POWER FET CONDUCTIVITY MODULATION (18544574)
- 1.10 VOLTAGE CONVERTER WITH AVERAGE INPUT CURRENT CONTROL AND INPUT-TO-OUTPUT ISOLATION (18525317)
- 1.11 ENABLING AN EXTERNAL RESISTOR FOR AN OSCILLATOR (18542861)
- 1.12 ULTRASOUND TRANSMIT-RECEIVE SWITCH WITH COMBINED TRANSMIT-RECEIVE AND RETURN-TO-ZERO PATH (18543305)
- 1.13 PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATED ISOLATION CIRCUIT (18542381)
- 1.14 DFE IMPLEMENTATION FOR WIRELINE APPLICATIONS (18532553)
- 1.15 SAMPLE ADAPTIVE OFFSET PARAMETER ESTIMATION FOR IMAGE AND VIDEO CODING (18387125)
- 1.16 METHODS AND APPARATUS TO SYNCHRONIZE DEVICES (18529105)
Patent applications for Texas Instruments Incorporated on April 11th, 2024
METHODS AND APPARATUS TO COMPARE VOLTAGES (17962139)
Main Inventor
Veeramanikandan Raju
AT-SPEED TEST OF FUNCTIONAL MEMORY INTERFACE LOGIC IN DEVICES (18392740)
Main Inventor
Devanathan Varadarajan
HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS (18527618)
Main Inventor
Jeffrey Alan West
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR DEVICE (17958254)
Main Inventor
Jie Chen
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM (17960871)
Main Inventor
Kwang-Soo Kim
STANDALONE ISOLATION CAPACITOR (18390395)
Main Inventor
Elizabeth Costner Stewart
REDUCED ESR IN TRENCH CAPACITOR (18543769)
Main Inventor
Jing Hu
MONOLITHIC INTEGRATION OF HIGH AND LOW-SIDE GAN FETS WITH SCREENING BACK GATING EFFECT (18543738)
Main Inventor
Dong Seup Lee
INTEGRATED BATTERY CHARGE REGULATION CIRCUIT BASED ON POWER FET CONDUCTIVITY MODULATION (18544574)
Main Inventor
Hakan ONER
VOLTAGE CONVERTER WITH AVERAGE INPUT CURRENT CONTROL AND INPUT-TO-OUTPUT ISOLATION (18525317)
Main Inventor
Jian LIANG
ENABLING AN EXTERNAL RESISTOR FOR AN OSCILLATOR (18542861)
Main Inventor
Nitin AGARWAL
ULTRASOUND TRANSMIT-RECEIVE SWITCH WITH COMBINED TRANSMIT-RECEIVE AND RETURN-TO-ZERO PATH (18543305)
Main Inventor
Aravind MIRIYALA
PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATED ISOLATION CIRCUIT (18542381)
Main Inventor
Giacomo Calabrese
DFE IMPLEMENTATION FOR WIRELINE APPLICATIONS (18532553)
Main Inventor
Raghu Ganesan
SAMPLE ADAPTIVE OFFSET PARAMETER ESTIMATION FOR IMAGE AND VIDEO CODING (18387125)
Main Inventor
Madhukar Budagavi
METHODS AND APPARATUS TO SYNCHRONIZE DEVICES (18529105)
Main Inventor
Tomas Motos
