Taiwan semiconductor manufacturing company, ltd. (20240136383). SEMICONDUCTOR DEVICE simplified abstract

SEMICONDUCTOR DEVICE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Yu-Chien Ku of Tainan City (TW)

Huai-Jen Tung of Tainan City (TW)

Keng-Ying Liao of Tainan City (TW)

Yi-Hung Chen of Kaohsiung (TW)

Shih-Hsun Hsu of New Taipei City (TW)

Yi-Fang Yang of Tainan City (TW)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136383 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The semiconductor device described in the abstract includes a single-layered dielectric layer, a conductive line, a conductive via, and a conductive pad. The conductive line and the conductive via are both located within the single-layered dielectric layer, while the conductive pad extends into the dielectric layer to establish electrical connection with the conductive line.

• The semiconductor device comprises a single-layered dielectric layer.
• A conductive line and a conductive via are positioned within the dielectric layer.
• A conductive pad extends into the dielectric layer to connect with the conductive line.

Potential Applications

The technology described in this patent application could be applied in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.

Problems Solved

This innovation helps in improving the electrical connectivity and signal transmission within semiconductor devices, leading to enhanced performance and reliability.

Benefits

The benefits of this technology include increased efficiency, reduced signal loss, improved electrical connections, and overall enhanced functionality of semiconductor devices.

Potential Commercial Applications

• "Enhancing Electrical Connectivity in Semiconductor Devices: Applications and Benefits"

Possible Prior Art

There may be prior art related to similar techniques for improving electrical connectivity within semiconductor devices, but specific examples are not provided in this context.

How does this technology impact the overall size of semiconductor devices?

The size reduction of semiconductor devices due to improved electrical connectivity is not addressed in the article.

What materials are used in the fabrication of the single-layered dielectric layer?

The specific materials used in the construction of the dielectric layer are not mentioned in the provided information.

Original Abstract Submitted

a semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. the conductive line and the conductive via are disposed in the single-layered dielectric layer. the conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.