Taiwan semiconductor manufacturing company, ltd. (20240136324). SEMICONDUCTOR MANUFACTURING METHOD simplified abstract
Contents
- 1 SEMICONDUCTOR MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wen-Chih Chiou of Hsinchu (TW)
SEMICONDUCTOR MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136324 titled 'SEMICONDUCTOR MANUFACTURING METHOD
Simplified Explanation
The semiconductor manufacturing method involves forming a first semiconductor element with a bonding film and a stressing film on opposite sides, creating a convex surface on the bonding film. A second semiconductor element with a bonding film is then formed on one side, and the two elements are bonded by connecting the bonding films.
- Formation of first semiconductor element with bonding film and stressing film
- Creation of convex surface on bonding film using stressing film
- Formation of second semiconductor element with bonding film
- Bonding of first and second semiconductor elements using bonding films
Potential Applications
This technology could be applied in the manufacturing of various semiconductor devices such as integrated circuits, microprocessors, and memory chips.
Problems Solved
This technology helps in improving the bonding process of semiconductor elements, ensuring a strong and reliable connection between different components.
Benefits
The method provides a more efficient and effective way of bonding semiconductor elements, leading to enhanced performance and reliability of semiconductor devices.
Potential Commercial Applications
The technology can be utilized in the production of advanced electronic devices for various industries including consumer electronics, telecommunications, and automotive.
Possible Prior Art
One possible prior art could be the use of different bonding techniques in semiconductor manufacturing processes, but the specific method described in this patent application may offer unique advantages in terms of bonding film formation and stress application.
Unanswered Questions
How does this method compare to traditional bonding techniques in terms of efficiency and reliability?
This article does not provide a direct comparison between this method and traditional bonding techniques, leaving uncertainty about the potential advantages or disadvantages of this new approach.
What are the specific semiconductor devices that could benefit the most from this bonding method?
The article does not specify the types of semiconductor devices that could see the greatest improvements from this bonding method, leaving room for further exploration into its targeted applications.
Original Abstract Submitted
a semiconductor manufacturing method is provided. the semiconductor manufacturing method includes the following steps. a first semiconductor element with a bonding film and a first stressing film is formed. the first bonding film and the first stressing film are formed on two opposite sides of the first semiconductor element. the first stressing film makes the first bonding film to have a first convex surface. a second semiconductor element with a second bonding film is formed. the second bonding film is formed on one side of the second semiconductor element. the first semiconductor element and the second semiconductor element are bonded by bonding the first bonding film and the second bonding film.
