Taiwan semiconductor manufacturing company, ltd. (20240136317). SUBSTRATE AND PACKAGE STRUCTURE simplified abstract
Contents
- 1 SUBSTRATE AND PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE AND PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE AND PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wei-Hung Lin of Xinfeng Township (TW)
Hsiu-Jen Lin of Zhubei City (TW)
Ming-Da Cheng of Taoyuan City (TW)
Yu-Min Liang of Zhongli City (TW)
Chen-Shien Chen of Zhubei City (TW)
SUBSTRATE AND PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136317 titled 'SUBSTRATE AND PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a substrate with different pad sizes in different areas.
- The substrate has a first area and a second area.
- Each pad on the substrate has a pad size.
- The pad size in the first area is larger than the pad size in the second area.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, such as semiconductors, where different pad sizes are required for specific functions or connections.
Problems Solved
This technology solves the problem of efficiently managing different pad sizes on a substrate, allowing for more precise and optimized connections in electronic devices.
Benefits
The benefits of this technology include improved performance and reliability of electronic devices, as well as potentially reducing manufacturing costs by optimizing pad sizes.
Potential Commercial Applications
- "Optimizing Pad Sizes for Enhanced Electronic Device Performance"
Possible Prior Art
There may be prior art related to optimizing pad sizes on substrates for electronic devices, but specific examples are not provided in this patent application.
Unanswered Questions
How does this technology impact the overall size of electronic devices?
The patent application does not mention how the different pad sizes may affect the overall size of electronic devices. This could be an important factor for manufacturers and designers to consider.
Are there any limitations to the size difference between pads in different areas?
The patent application does not address any potential limitations or constraints on the size difference between pads in the first and second areas. Understanding these limitations could be crucial for implementing this technology effectively.
Original Abstract Submitted
according to an exemplary embodiment, a substrate having a first area and a second area is provided. the substrate includes a plurality of pads. each of the pads has a pad size. the pad size in the first area is larger than the pad size in the second area.
