Taiwan semiconductor manufacturing company, ltd. (20240136293). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
Contents
- 1 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chih-Wei Wu of Yilan County (TW)
Wen-Chih Chiou of Miaoli County (TW)
Ying-Ching Shih of Hsinchu City (TW)
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136293 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Simplified Explanation
The patent application describes a package structure with a joint structure and a method of forming the same. The package structure includes a first under bump metallurgy (UBM) structure on a dielectric layer, consisting of a barrier layer embedded in the dielectric layer and an upper metal layer on top of the barrier layer. A solder layer is also present on the UBM structure, contacting the upper metal layer.
- Explanation of the patent/innovation:
- Package structure with joint structure - First UBM structure with barrier layer and upper metal layer - Solder layer on the UBM structure
Potential Applications
The technology could be applied in semiconductor packaging, electronic devices, and integrated circuits.
Problems Solved
- Improved reliability and performance of package structures - Enhanced electrical connections between components
Benefits
- Increased durability and longevity of electronic devices - Enhanced signal transmission and connectivity - Improved overall performance of integrated circuits
Potential Commercial Applications
"Advanced Package Structure with Joint Structure for Enhanced Performance" could be used in the semiconductor industry, consumer electronics, telecommunications, and automotive electronics.
Possible Prior Art
Prior art may include existing package structures with under bump metallurgy layers and solder connections in semiconductor packaging.
Unanswered Questions
How does this technology compare to traditional package structures in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this advanced package structure compared to traditional methods.
What are the environmental impacts of using this technology in electronic devices?
The environmental sustainability aspects of the materials used in this technology and their disposal are not addressed in the article.
Original Abstract Submitted
provided are a package structure having a joint structure and a method of forming the same. the package structure includes: a first under bump metallurgy (ubm) structure disposed on a first dielectric layer, wherein the first ubm structure at least comprises: a barrier layer embedded in the first dielectric layer; and an upper metal layer disposed over the barrier layer, wherein a sidewall of the barrier layer is laterally offset outward from a sidewall of the upper metal layer, and a portion of a top surface of the barrier layer is exposed by the first dielectric layer; and a solder layer disposed on the first ubm structure and contacting the upper metal layer.
