Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chung-Jung Wu of Hsinchu City (TW)
Chih-Hang Tung of Hsinchu (TW)
Tung-Liang Shao of Hsinchu (TW)
Sheng-Tsung Hsiao of Taoyuan City (TW)
Jen-Yu Wang of Hsinchu City (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136251 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device described in the patent application includes a package with a cooling cover. The package contains a first die with micro-trenches in the cooling region of the rear surface. The cooling cover has fluid inlet and outlet ports connected to the micro-trenches.
- The semiconductor device has a package with a cooling cover.
- The first die in the package has micro-trenches in the cooling region of the rear surface.
- The cooling cover has fluid inlet and outlet ports connected to the micro-trenches.
Potential Applications
The technology described in this patent application could be applied in:
- High-performance computing systems
- Data centers
- Automotive electronics
Problems Solved
This technology helps in:
- Efficient cooling of semiconductor devices
- Enhancing thermal management
- Improving overall performance and reliability
Benefits
The benefits of this technology include:
- Increased efficiency in heat dissipation
- Extended lifespan of semiconductor devices
- Enhanced performance under high workloads
Potential Commercial Applications
The technology could be commercially applied in:
- Server farms
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art for this technology could be:
- Liquid cooling systems for electronic devices
Unanswered Questions
How does this technology compare to traditional air cooling methods?
This article does not provide a direct comparison between this technology and traditional air cooling methods. It would be interesting to see a study on the efficiency and cost-effectiveness of both methods.
Are there any limitations to the size or shape of the semiconductor devices that can be cooled using this technology?
The article does not mention any limitations regarding the size or shape of the semiconductor devices. It would be beneficial to know if there are any restrictions in this regard.
Original Abstract Submitted
a semiconductor device includes a package and a cooling cover. the package includes a first die having an active surface and a rear surface opposite to the active surface. the rear surface has a cooling region and a peripheral region enclosing the cooling region. the first die includes micro-trenches located in the cooling region of the rear surface. the cooling cover is stacked on the first die. the cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
