Taiwan semiconductor manufacturing company, ltd. (20240136246). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Hsinchu County (TW)
Po-Chen Lai of Hsinchu County (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136246 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device described in the patent application consists of a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is located next to the package structure, while the second heat spreader is in direct contact with the first heat spreader. The second heat spreader covers both the top surface and sidewalls of the package structure, and the materials of the two heat spreaders are different.
- The semiconductor device includes a package structure, a first heat spreader, and a second heat spreader.
- The first heat spreader is positioned adjacent to the package structure.
- The second heat spreader is in physical contact with the first heat spreader and covers the top surface and sidewalls of the package structure.
- The materials of the first and second heat spreaders are different.
Potential Applications
The technology described in this patent application could be applied in:
- High-performance computing devices
- Data centers
- Automotive electronics
Problems Solved
This technology helps in:
- Improving thermal management in semiconductor devices
- Enhancing overall performance and reliability
- Reducing the risk of overheating
Benefits
The benefits of this technology include:
- Increased efficiency of semiconductor devices
- Extended lifespan of electronic components
- Enhanced thermal dissipation capabilities
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications equipment
- Industrial machinery
Possible Prior Art
One possible prior art could be:
- Heat spreader designs in existing semiconductor devices
Unanswered Questions
How does the material difference between the first and second heat spreaders impact the overall performance of the semiconductor device?
The material difference between the first and second heat spreaders could affect the thermal conductivity and heat dissipation capabilities of the device, but the exact impact is not specified in the abstract.
What specific manufacturing processes are used to create the package structure and heat spreaders in this semiconductor device?
The abstract does not provide details on the specific manufacturing processes involved in creating the package structure and heat spreaders, leaving this aspect open for further exploration.
Original Abstract Submitted
a semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. the first heat spreader is aside the package structure. the second heat spreader is in physical contact with the first heat spreader. the second heat spreader covers a top surface and sidewalls of the package structure. a material of the first heat spreader is different from a material of the second heat spreader.
