Taiwan semiconductor manufacturing company, ltd. (20240136221). INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP simplified abstract
Contents
- 1 INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Shao-Kuan Lee of Kaohsiung City (TW)
Hai-Ching Chen of Hsinchu City (TW)
Hsin-Yen Huang of New Taipei City (TW)
Cheng-Chin Lee of Taipei City (TW)
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136221 titled 'INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
Simplified Explanation
The present disclosure relates to an integrated chip with a first metal line, a via, a first dielectric structure, and a first protective etch-stop structure.
- The integrated chip comprises a first metal line over a substrate.
- A via is directly over the top of the first metal line and has a first lower surface and a second lower surface.
- A first dielectric structure is laterally adjacent to the first metal line and along its sidewall.
- A first protective etch-stop structure is over the top of the first dielectric structure, vertically separating the second lower surface of the via from the top of the first dielectric structure.
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for the development of advanced integrated chips with improved performance and reliability.
Problems Solved
This technology solves the problem of signal interference and degradation in integrated chips by providing a structure that separates different components and prevents unwanted interactions.
Benefits
The benefits of this technology include enhanced signal integrity, increased chip efficiency, and overall improved functionality of integrated circuits.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of high-performance electronic devices such as smartphones, tablets, and computers.
Possible Prior Art
Prior art in the field of semiconductor manufacturing may include similar structures and methods for improving the performance of integrated circuits.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The cost-effectiveness of implementing this technology compared to other solutions is not addressed in the abstract.
What are the specific technical specifications of the integrated chip described in the patent application?
The abstract provides a general overview of the integrated chip structure but does not delve into specific technical details.
Original Abstract Submitted
in some embodiments, the present disclosure relates to an integrated chip. the integrated chip may comprise a first metal line disposed over a substrate. a via may be disposed directly over a top of the first metal line and the via may comprise a first lower surface and a second lower surface above the first lower surface. a first dielectric structure may be disposed laterally adjacent to the first metal line and may be disposed along a sidewall of the first metal line. a first protective etch-stop structure may be disposed directly over a top of the first dielectric structure and the first protective etch-stop structure may vertically separate the second lower surface of the via from the top of the first dielectric structure.
