Taiwan semiconductor manufacturing company, ltd. (20240136213). MODULAR PRESSURIZED WORKSTATION simplified abstract
Contents
- 1 MODULAR PRESSURIZED WORKSTATION
MODULAR PRESSURIZED WORKSTATION
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chun-Jung Huang of Yunlin County (TW)
Kuang Huan Hsu of Hsinchu City (TW)
Jeff Chen of New Taipei City (TW)
Steven Huang of Miaoli County (TW)
Yueh-Lun Yang of Hsinchu County (TW)
MODULAR PRESSURIZED WORKSTATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136213 titled 'MODULAR PRESSURIZED WORKSTATION
Simplified Explanation
The patent application describes a system for handling semiconductor workpieces within a workstation body, utilizing modular tools for processing and inspection.
- The system includes a workstation body with two pressurized load ports for moving semiconductor workpieces at a set pressure level.
- A first modular tool is interfaced with the first pressurized load port for processing the semiconductor workpiece.
- A second modular tool is interfaced with the second pressurized load port for inspecting the semiconductor workpiece processed by the first modular tool.
Potential Applications
The technology described in the patent application could be applied in semiconductor manufacturing facilities for efficient processing and inspection of semiconductor workpieces.
Problems Solved
1. Streamlining the handling and processing of semiconductor workpieces within a controlled environment. 2. Enhancing the accuracy and efficiency of inspection processes for semiconductor workpieces.
Benefits
1. Increased productivity and throughput in semiconductor manufacturing operations. 2. Improved quality control and reliability in semiconductor processing. 3. Simplified workflow and reduced risk of contamination in handling semiconductor workpieces.
Potential Commercial Applications
Optimizing Semiconductor Workpiece Handling and Processing System for Enhanced Efficiency and Quality Control
Possible Prior Art
There may be existing systems or methods for handling and processing semiconductor workpieces within controlled environments, but specific prior art is not provided in the patent application.
Unanswered Questions
== How does the system ensure the compatibility and interchangeability of different modular tools within the workstation body? The patent application does not detail the specific mechanisms or protocols in place to ensure the seamless integration and operation of different modular tools within the workstation body.
== What are the potential maintenance requirements and costs associated with the internal material handling system of the workstation body? The patent application does not address the maintenance procedures or cost implications of the internal material handling system used to move semiconductor workpieces within the workstation body.
Original Abstract Submitted
in an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.
