Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract
Contents
- 1 PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
An-Jhih Su of Taoyuan City (TW)
Wei-Yu Chen of New Taipei City (TW)
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136203 titled 'PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Simplified Explanation
The method described in the patent application involves integrating an electronic die and a photonic die on a carrier, encapsulating them, planarizing the encapsulant, and forming redistribution lines to connect the electronic and photonic dies. An optical coupler is attached to the photonic die, with an optical fiber connected to the coupler for optical coupling.
- Placing electronic and photonic dies on a carrier
- Encapsulating and planarizing the dies
- Forming redistribution lines to connect the dies
- Attaching an optical coupler to the photonic die
- Connecting an optical fiber to the optical coupler
Potential Applications
This technology could be used in:
- Optical communication systems
- Photonic integrated circuits
- High-speed data transmission
Problems Solved
This technology helps in:
- Improving optical coupling efficiency
- Enhancing signal transmission speed
- Reducing size and complexity of optical systems
Benefits
The benefits of this technology include:
- Increased data transfer rates
- Enhanced reliability of optical connections
- Compact and efficient optical systems
Potential Commercial Applications
The potential commercial applications of this technology include:
- Telecommunications industry
- Data centers
- Aerospace and defense sector
Possible Prior Art
One possible prior art for this technology could be the integration of electronic and photonic components in a similar manner for optical communication systems.
What are the specific materials used for encapsulating the electronic and photonic dies?
The specific materials used for encapsulating the electronic and photonic dies are not mentioned in the abstract. Further details on the encapsulation process and materials would be needed to answer this question.
How does the optical coupler ensure efficient optical coupling to the photonic die?
The abstract does not provide specific details on how the optical coupler ensures efficient optical coupling to the photonic die. Additional information on the design and functionality of the optical coupler would be required to answer this question accurately.
Original Abstract Submitted
a method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. the method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. the redistribution lines electrically connect the electronic die to the photonic die. an optical coupler is attached to the photonic die. an optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
