Taiwan semiconductor manufacturing company, ltd. (20240134279). PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing photoresist formulations on the market?
- 1.11 What are the potential environmental impacts of using this new photoresist formulation?
- 1.12 Original Abstract Submitted
PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chieh-Hsin Hsieh of Hsinchu County (TW)
Wei-Han Lai of New Taipei City (TW)
Ching-Yu Chang of Yilang County (TW)
PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240134279 titled 'PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a photoresist containing a solvent, a polymer, and an additive. The polymer is dissolved in the solvent, while the additive is dispersed in the solvent. The additive contains a double bond or an epoxy group and has a surface tension different from that of the polymer.
- The photoresist includes a solvent, a polymer, and an additive.
- The polymer is dissolved in the solvent, and the additive is dispersed in the solvent.
- The additive contains a double bond or an epoxy group.
- The additive has a surface tension different from the polymer.
Potential Applications
The technology described in this patent application could be used in the manufacturing of electronic components, such as semiconductors, by providing a more precise and efficient way to create patterns on substrates.
Problems Solved
This technology solves the problem of achieving high-resolution patterns on substrates by using a photoresist with unique additive properties that enhance the overall performance of the material.
Benefits
The benefits of this technology include improved resolution, increased efficiency in pattern creation, and potentially lower production costs due to the optimized properties of the photoresist.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for the production of advanced electronic devices with high precision and performance.
Possible Prior Art
One possible prior art could be the use of different additives in photoresists to modify their properties and improve their performance in creating patterns on substrates.
Unanswered Questions
How does this technology compare to existing photoresist formulations on the market?
This article does not provide a direct comparison with existing photoresist formulations, leaving uncertainty about the specific advantages and disadvantages of this new technology.
What are the potential environmental impacts of using this new photoresist formulation?
The potential environmental impacts of using this new photoresist formulation are not addressed in this article, raising questions about the sustainability and safety aspects of the technology.
Original Abstract Submitted
a photoresist includes a solvent, a polymer and an additive. the polymer is dissolved in the solvent, and the additive is dispersed in the solvent. the additive includes a double bond or includes an epoxy group. the additive has a surface tension different from a surface tension of the polymer.
