Taiwan semiconductor manufacturing company, ltd. (20240133942). TESTING MODULE AND TESTING METHOD USING THE SAME simplified abstract
Contents
- 1 TESTING MODULE AND TESTING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TESTING MODULE AND TESTING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TESTING MODULE AND TESTING METHOD USING THE SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hao Chen of New Taipei City (TW)
TESTING MODULE AND TESTING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240133942 titled 'TESTING MODULE AND TESTING METHOD USING THE SAME
Simplified Explanation
The testing module for a semiconductor wafer-form package described in the abstract includes a circuit board structure with connectors and bridge connectors to facilitate testing of the semiconductor wafer-form package.
- Circuit board structure with edge regions and a main region
- First connectors located over the edge regions and connected to the circuit board structure
- First connecting structure located over and distant from the circuit board structure
- Second connectors and third connectors located over and connected to the first connecting structure
- Third connectors transmit electric signals for testing the semiconductor wafer-form package
- First bridge connector electrically coupling the circuit board structure and the first connecting structure
Potential Applications
The technology described in the patent application could be used in the semiconductor industry for testing semiconductor wafer-form packages efficiently and accurately.
Problems Solved
This technology solves the problem of effectively testing semiconductor wafer-form packages during the manufacturing process.
Benefits
The benefits of this technology include improved testing processes, increased efficiency, and potentially higher quality control in semiconductor manufacturing.
Potential Commercial Applications
- "Semiconductor Wafer-Form Package Testing Module: Enhancing Semiconductor Manufacturing Efficiency"
Possible Prior Art
There may be prior art related to testing modules for semiconductor packages, but specific examples are not provided in the abstract.
Unanswered Questions
How does this technology compare to existing testing modules for semiconductor wafer-form packages?
The article does not provide a direct comparison with existing technologies in the field.
What are the specific technical specifications of the connectors and bridge connectors used in this testing module?
The abstract does not delve into the technical details of the connectors and bridge connectors utilized in the testing module.
Original Abstract Submitted
a testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. the circuit board structure includes two edge regions and a main region located therebetween. the first connectors are located over the edge regions and connected to the circuit board structure. the first connecting structure is located over and distant from the circuit board structure. the second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. the first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors.
