Taiwan semiconductor manufacturing company, ltd. (20240120294). CHIP PACKAGE WITH LID simplified abstract

CHIP PACKAGE WITH LID

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Shu-Shen Yeh of Taoyuan City (TW)

Chin-Hua Wang of New Taipei City (TW)

Kuang-Chun Lee of New Taipei City (TW)

Po-Yao Lin of Zhudong Township (TW)

Shyue-Ter Leu of Hsinchu City (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

CHIP PACKAGE WITH LID - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120294 titled 'CHIP PACKAGE WITH LID

Simplified Explanation

The chip package described in the abstract includes a substrate, a semiconductor chip, and a thermal conductive structure. The package also features first and second support structures below the thermal conductive structure, connecting the substrate and corners of the thermal conductive structure. The support structures, along with a side edge of the thermal conductive structure, define an opening that exposes a space surrounding the semiconductor chip. The support structures are disposed along a side of the substrate, with specific lateral distances separating them from the side of the substrate and the side edge of the thermal conductive structure.

• The chip package includes a substrate, semiconductor chip, and thermal conductive structure.
• First and second support structures connect the substrate and corners of the thermal conductive structure.
• Support structures, along with a side edge of the thermal conductive structure, define an opening exposing the semiconductor chip.
• Support structures are laterally separated from the substrate and side edge of the thermal conductive structure by specific distances.

Potential Applications

The technology described in this patent application could be applied in various electronic devices, such as smartphones, laptops, and other computing devices that require efficient thermal management for the semiconductor chips.

Problems Solved

This technology helps in improving the thermal conductivity and heat dissipation of semiconductor chips, which can prevent overheating issues and enhance the overall performance and reliability of electronic devices.

Benefits

The benefits of this technology include improved thermal management, increased performance and reliability of electronic devices, and potentially extending the lifespan of semiconductor chips.

Potential Commercial Applications

One potential commercial application of this technology could be in the manufacturing of high-performance electronic devices, where efficient thermal management is crucial for optimal operation and longevity.

Possible Prior Art

One possible prior art for this technology could be similar chip package designs that focus on thermal management and heat dissipation in electronic devices.

How does this technology compare to existing thermal management solutions in the market?

This article does not provide a direct comparison with existing thermal management solutions, leaving the reader to wonder about the specific advantages and disadvantages of this technology in relation to others.

What specific electronic devices could benefit the most from this technology?

The article does not mention any specific electronic devices that could benefit the most from this technology, leaving the reader to speculate on potential applications in different industries or products.

Original Abstract Submitted

a chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. the chip package includes a first and a second support structures below the thermal conductive structure. the first and the second support structures connect the substrate and corners of the thermal conductive structure. the thermal conductive structure has a side edge connecting the first and the second support structures. the first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. the first and the second support structures are disposed along a side of the substrate. the first support structure is laterally separated from the side of the substrate by a first lateral distance. the side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.