Taiwan semiconductor manufacturing company, ltd. (20240120207). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Lung-Kai Mao of Kaohsiung City (TW)
Wen-Hsiung Lu of Tainan City (TW)
Pei-Wei Lee of Pingtung County (TW)
Szu-Hsien Lee of Tainan City (TW)
Chieh-Ning Feng of Taichung City (TW)
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120207 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes a die with multiple devices on a first substrate, where the first substrate has a dopant at a certain concentration and a specific width. The package also includes a second substrate fused with the first substrate, with a higher dopant concentration and a wider width along the horizontal direction.
- Die with multiple devices on a first substrate
- First substrate with dopant at a certain concentration and specific width
- Second substrate fused with the first substrate
- Second substrate with higher dopant concentration and wider width
Potential Applications
The technology described in this patent application could be applied in:
- Semiconductor manufacturing
- Electronic devices
- Integrated circuits
Problems Solved
This technology addresses issues related to:
- Enhancing semiconductor performance
- Improving device reliability
- Increasing substrate flexibility
Benefits
The benefits of this technology include:
- Higher dopant concentration for improved performance
- Enhanced substrate strength and durability
- Greater flexibility in design and manufacturing
Potential Commercial Applications
The potential commercial applications of this technology could be seen in:
- Consumer electronics
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art related to this technology is the use of multiple substrates in semiconductor packaging to enhance device performance and reliability.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison with other semiconductor packaging methods in terms of performance, cost, or scalability.
What are the specific devices that can benefit from this technology?
The article does not specify the types of devices or applications that can benefit the most from the described semiconductor package.
Original Abstract Submitted
a semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. the semiconductor package further includes a second substrate fused with the first substrate, where the second substrate includes the dopant at a second concentration greater than the first concentration. the second substrate has a second width along the horizontal direction, where the second width is greater than the first width
