Taiwan semiconductor manufacturing company, ltd. (20240112983). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chuei-Tang Wang of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240112983 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device described in the abstract includes a substrate, a semiconductor component, and a heat dissipation component. The semiconductor component is placed on the substrate, while the heat dissipation component is also on the substrate and features a cavity, an inlet, and an outlet that connect to the cavity.
- The semiconductor device comprises a substrate, semiconductor component, and heat dissipation component.
- The semiconductor component is positioned on the substrate.
- The heat dissipation component is located on the substrate and includes a cavity, an inlet, and an outlet that communicate with the cavity.
Potential Applications
The technology described in this patent application could be applied in various fields such as:
- Electronics
- Telecommunications
- Automotive industry
Problems Solved
This technology addresses several issues, including:
- Overheating of semiconductor components
- Improper heat dissipation
- Ensuring optimal performance of electronic devices
Benefits
The benefits of this technology include:
- Improved efficiency of semiconductor devices
- Enhanced reliability
- Extended lifespan of electronic components
Potential Commercial Applications
With its heat dissipation capabilities, this technology could be utilized in:
- Computer processors
- LED lighting systems
- Solar panels
Possible Prior Art
One possible prior art for this technology could be the use of heat sinks in electronic devices to dissipate heat effectively.
Unanswered Questions
How does this technology compare to existing heat dissipation methods?
This article does not provide a direct comparison to other heat dissipation methods currently available in the market.
What specific materials are used in the construction of the heat dissipation component?
The article does not detail the specific materials used in the construction of the heat dissipation component.
Original Abstract Submitted
a semiconductor device includes a substrate, a semiconductor component and a heat dissipation component. the semiconductor component is disposed on the substrate. the heat dissipation component is disposed on the substrate and having a cavity, an inlet and an outlet, wherein the inlet and the outlet communicate with the cavity.
