Taiwan semiconductor manufacturing company, ltd. (20240105631). Three-Dimensional Semiconductor Device and Method simplified abstract
Contents
- 1 Three-Dimensional Semiconductor Device and Method
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Three-Dimensional Semiconductor Device and Method - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Three-Dimensional Semiconductor Device and Method
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Sheng-Chi Lin of Yilan County (TW)
Tsung-Ding Wang of Tainan (TW)
Chien-Hsun Lee of Chu-tung Town (TW)
Three-Dimensional Semiconductor Device and Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105631 titled 'Three-Dimensional Semiconductor Device and Method
Simplified Explanation
The abstract describes a method for performing a carrier switch for a device wafer, attaching a second wafer, and removing a first wafer. A buffer layer is deposited over the device wafer to reduce the surface topography. After the carrier switch, a film-on-wire layer is removed from the buffer layer, followed by at least partial removal of the buffer layer.
- Method for performing a carrier switch for a device wafer
- Deposition of a buffer layer to reduce surface topography
- Attachment of a second wafer and removal of a first wafer
- Removal of a film-on-wire layer from the buffer layer
- Partial removal of the buffer layer
Potential Applications
This technology could be applied in semiconductor manufacturing processes, specifically in the fabrication of integrated circuits and other electronic devices.
Problems Solved
1. Minimizing surface topography on device wafers 2. Facilitating the attachment and removal of wafers in semiconductor manufacturing processes
Benefits
1. Improved efficiency in wafer processing 2. Enhanced quality and reliability of electronic devices 3. Reduction of defects and yield improvement in semiconductor production
Potential Commercial Applications
Optimizing semiconductor manufacturing processes for increased productivity and yield improvement
Possible Prior Art
Prior methods for wafer processing may have involved different techniques for reducing surface topography and attaching/removing wafers, but specific details would need to be researched further.
Unanswered Questions
How does the buffer layer affect the overall performance of the device wafer?
The article does not provide information on how the buffer layer impacts the functionality or performance of the device wafer.
Are there any limitations or drawbacks to this method compared to existing techniques?
The article does not address any potential limitations or drawbacks of the described method in comparison to other methods used in semiconductor manufacturing.
Original Abstract Submitted
embodiments provide a method of performing a carrier switch for a device wafer, attaching a second wafer and removing a first wafer. a buffer layer is deposited over the device wafer, buffer layer reducing the topography of the surface of the device wafer. after the carrier switch a film-on-wire layer is removed from the buffer layer and then the buffer layer is at least in part removed.
