Taiwan semiconductor manufacturing company, ltd. (20240105601). DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS simplified abstract

DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Wei-An Lai of Hsinchu (TW)

Te-Hsin Chiu of Hsinchu (TW)

Shih-Wei Peng of Hsinchu (TW)

Wei-Cheng Lin of Hsinchu (TW)

Jiann-Tyng Tzeng of Hsinchu (TW)

Chia-Tien Wu of Hsinchu (TW)

DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105601 titled 'DEEP LINES AND SHALLOW LINES IN SIGNAL CONDUCTING PATHS

Simplified Explanation

An integrated circuit described in the patent application includes various lines and active devices that are strategically coupled to different portions of conducting paths. The circuit is designed to optimize performance by utilizing low resistivity and low capacitance portions effectively.

• The integrated circuit includes a plurality of first layer deep lines, first layer shallow lines, second layer deep lines, and second layer shallow lines.
• The circuit also features a first active device and a second active device connected to a conducting path with low resistivity and low capacitance portions.
• The first active device is linked to a first layer deep line in the low resistivity portion, while the second active device is connected to a first layer shallow line in the low capacitance portion.
• The low resistivity portion excludes first layer shallow lines and second layer shallow lines, while the low capacitance portion excludes first layer deep lines and second layer deep lines.

Potential Applications

This technology could be applied in various electronic devices and systems that require high performance and efficient signal processing capabilities.

Problems Solved

This innovation helps in reducing signal interference, improving signal transmission speed, and enhancing overall circuit efficiency.

Benefits

The integrated circuit design offers improved performance, reduced power consumption, and enhanced reliability in electronic devices.

Potential Commercial Applications

This technology could be utilized in telecommunications equipment, computer hardware, consumer electronics, and other high-tech industries.

Possible Prior Art

Prior art may include similar integrated circuit designs that aim to optimize signal processing and transmission efficiency.

How does this technology compare to existing integrated circuit designs in terms of performance and efficiency?

This article does not provide a direct comparison with existing integrated circuit designs to evaluate the performance and efficiency improvements offered by this technology.

What are the specific technical specifications and requirements for implementing this integrated circuit design in practical applications?

The article does not detail the specific technical specifications or requirements for implementing this integrated circuit design in real-world applications.

Original Abstract Submitted

an integrated circuit includes a plurality of first layer deep lines, a plurality of first layer shallow lines, a plurality of second layer deep lines, and a plurality of second layer shallow lines. the integrated circuit also includes a first active device and a second active device coupled between a conducting path that has a low resistivity portion and a low capacitivity portion. the first active device has an output coupled to a first layer deep line that is in the low resistivity portion. the second active device has an input coupled to a first layer shallow line that is in the low capacitivity portion. the low resistivity portion excludes the first layer shallow lines and the second layer shallow lines, and the low capacitivity portion excludes the first layer deep lines and the second layer deep lines.