Taiwan semiconductor manufacturing company, ltd. (20240105500). METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED THEREOF simplified abstract
Contents
- 1 METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chin-Hsiang Lin of Hsinchu (TW)
Pinyen Lin of Rochester NY (US)
METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105500 titled 'METHODS FOR SEAM REPAIR AND SEMICONDUCTOR STRUCTURE MANUFACTURED THEREOF
Simplified Explanation
The present disclosure describes a method for repairing a seam within a conformally deposited material using a carrier at a supercritical fluid phase.
- Seam repairing precursor sources are delivered to seams or voids using a carrier at a supercritical fluid phase.
- The carrier at the supercritical fluid phase has liquid-like density and gas-like high diffusion capability.
- Carbon dioxide or argon may be used as a carrier in some embodiments.
Potential Applications
This technology could be applied in industries such as manufacturing, construction, and electronics for repairing seams in materials.
Problems Solved
This technology solves the problem of efficiently repairing seams within conformally deposited materials without damaging the structure.
Benefits
The benefits of this technology include precise and effective repair of seams, reduced downtime for repairs, and improved structural integrity.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor manufacturing, aerospace engineering, and automotive production.
Possible Prior Art
One possible prior art could be the use of traditional methods such as manual repair or chemical bonding for repairing seams in materials.
Unanswered Questions
1. How does the cost of implementing this technology compare to traditional seam repair methods? 2. Are there any limitations to the types of materials that can be repaired using this method?
Original Abstract Submitted
the present disclosure provides a method for repairing a seam within a conformally deposited material. one or more seam repairing precursor sources may be delivered to seams or voids using a carrier at a super critical fluid phase. at the super critical fluid phase, the carrier has liquid like density and gas like high diffusion capability, therefore capable of delivering the repairing precursor sources to seams or voids under surfaces of a structure. in some embodiments, carbon dioxide or argon may be used as a carrier.
