Taiwan semiconductor manufacturing company, ltd. (20240103220). PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
Contents
- 1 PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Kuo-Chiang Ting of Hsinchu (TW)
Sung-Hui Huang of Dongshan Township (TW)
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240103220 titled 'PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Simplified Explanation
The patent application describes a device with a first package connected to an interconnect substrate containing conductive routing, and a second package connected to the interconnect substrate with a photonic layer including a silicon waveguide, a grating coupler, and a photodetector. An interconnect structure over the photonic layer connects the photodetector to a via, with an electronic die bonded to the interconnect structure.
- First package connected to an interconnect substrate
- Second package with photonic layer including silicon waveguide, grating coupler, and photodetector
- Interconnect structure connecting photodetector to via
- Electronic die bonded to interconnect structure
Potential Applications
The technology described in the patent application could be applied in:
- High-speed data communication systems
- Optical sensing devices
- Integrated photonics circuits
Problems Solved
The technology addresses the following issues:
- Efficient data transfer between electronic and photonic components
- Miniaturization of devices with integrated photonics
- Enhanced performance of photonic devices
Benefits
The technology offers the following benefits:
- Improved data transfer speeds
- Compact and integrated design
- Enhanced reliability and performance
Potential Commercial Applications
The technology could find commercial applications in:
- Telecommunications industry
- Data centers
- Biomedical devices
Possible Prior Art
One possible prior art for this technology could be the integration of electronic and photonic components in a single package for improved data transfer speeds and efficiency.
Unanswered Questions
How does the device handle power consumption in high-speed data communication systems?
The patent application does not provide specific details on power consumption management in the device.
What materials are used in the construction of the photonic layer for optimal performance?
The patent application does not specify the materials used in the construction of the photonic layer.
Original Abstract Submitted
a device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.
