Taiwan semiconductor manufacturing co., ltd. (20240130252). THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE simplified abstract
Contents
- 1 THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Tsung-Hsueh Yang of Taichung City (TW)
THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240130252 titled 'THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE
Simplified Explanation
The present disclosure is directed towards an integrated chip including a heater structure overlying a semiconductor substrate. A phase change element (PCE) is disposed over the heater structure. A thermal barrier structure is disposed between the heater structure and the PCE. Outer sidewalls of the PCE are spaced laterally between outer sidewalls of the thermal barrier structure.
- Integrated chip with heater structure and phase change element
- Thermal barrier structure between heater and phase change element
- Lateral spacing of outer sidewalls of phase change element and thermal barrier structure
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Microelectronics
- Thermal management systems
- Semiconductor manufacturing
Problems Solved
This technology addresses the following issues:
- Heat dissipation in integrated chips
- Thermal stress on semiconductor substrates
- Efficient phase change element operation
Benefits
The benefits of this technology include:
- Improved thermal performance
- Enhanced reliability of integrated chips
- Increased efficiency of phase change elements
Potential Commercial Applications
The technology described in this patent application could have potential commercial applications in:
- Consumer electronics
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art for this technology could be the use of thermal barrier structures in integrated chips to improve thermal management and performance.
Unanswered Questions
How does the lateral spacing of outer sidewalls impact the overall efficiency of the integrated chip?
The lateral spacing of outer sidewalls plays a crucial role in ensuring proper heat dissipation and thermal management within the integrated chip. By maintaining a specific distance between the outer sidewalls of the phase change element and the thermal barrier structure, the efficiency of the chip can be optimized.
What are the potential challenges in implementing this technology on a larger scale for commercial applications?
Scaling up this technology for commercial applications may pose challenges in terms of manufacturing processes, cost-effectiveness, and integration with existing systems. Addressing these challenges will be crucial for the successful adoption of this technology in various industries.
Original Abstract Submitted
the present disclosure is directed towards an integrated chip including a heater structure overlying a semiconductor substrate. a phase change element (pce) is disposed over the heater structure. a thermal barrier structure is disposed between the heater structure and the pce. outer sidewalls of the pce are spaced laterally between outer sidewalls of the thermal barrier structure.
