Taiwan semiconductor manufacturing co., ltd. (20240128218). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Hung-Pin Chang of New Taipei City (TW)

Wei-Cheng Wu of Hsinchu City (TW)

Ming-Shih Yeh of Hsinchu County (TW)

An-Jhih Su of Taoyuan City (TW)

Der-Chyang Yeh of Hsin-Chu (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128218 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor package described in the abstract includes a first semiconductor substrate with an array of conductive bumps, a second semiconductor substrate, and a spacing pattern. The first semiconductor substrate has a pad region with an array of first pads, where the conductive bumps are placed. The second semiconductor substrate is positioned over the first substrate and has an array of second pads bonded to the conductive bumps. The spacing pattern is located at the periphery of the pad region.

• The semiconductor package consists of a first semiconductor substrate with an array of conductive bumps, a second semiconductor substrate, and a spacing pattern.
• The first semiconductor substrate contains a pad region with an array of first pads, where the conductive bumps are placed.
• The second semiconductor substrate is positioned over the first substrate and has an array of second pads bonded to the conductive bumps.
• The spacing pattern is located at the periphery of the pad region.

Potential Applications

This technology could be used in:

• Semiconductor packaging
• Integrated circuits
• Microelectronics

Problems Solved

This technology helps in:

• Improving connectivity between semiconductor substrates
• Enhancing overall performance of semiconductor devices

Benefits

The benefits of this technology include:

• Increased efficiency in semiconductor packaging
• Better signal transmission between substrates
• Enhanced reliability of semiconductor devices

Potential Commercial Applications

This technology could be applied in:

• Electronics manufacturing industry
• Semiconductor companies
• Research and development organizations

Possible Prior Art

One possible prior art for this technology could be:

• Existing semiconductor packaging methods
• Previous designs of conductive bump arrays

How does this technology compare to traditional semiconductor packaging methods?

This article does not provide a direct comparison between this technology and traditional semiconductor packaging methods.

What are the specific materials used in the conductive bumps and pads in this semiconductor package?

The article does not mention the specific materials used in the conductive bumps and pads in this semiconductor package.

Original Abstract Submitted

a semiconductor package includes a first semiconductor substrate, an array of conductive bumps, a second semiconductor substrate, and a spacing pattern. the first semiconductor substrate includes a pad region and an array of first pads disposed within the pad region. the array of conductive bumps is disposed on the array of first pads respectively. the second semiconductor substrate is disposed over the first semiconductor substrate and includes an array of second pads bonded to the array of conductive bumps respectively. the spacing pattern is disposed between the first semiconductor substrate and the second semiconductor substrate, wherein the spacing pattern is located at a periphery of the pad region.