Taiwan semiconductor manufacturing co., ltd. (20240128217). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chen Chiang Yu of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128217 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device described in the abstract includes two semiconductor dies connected to each other, each die having a substrate, a conductive bump, and a conductive contact. The conductive contact of each die has an outer lateral sidewall with an inner acute angle smaller than 85°, and the contacts of the two dies are connected opposite to each other.
- The semiconductor device consists of two semiconductor dies connected to each other.
- Each die includes a substrate, a conductive bump, and a conductive contact.
- The conductive contact of each die has an outer lateral sidewall with an inner acute angle smaller than 85°.
- The conductive contacts of the two dies are connected opposite to each other.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit design
Problems Solved
This technology helps in:
- Improving connectivity between semiconductor dies
- Enhancing performance of semiconductor devices
- Reducing signal interference
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor devices
- Enhanced reliability of connections
- Improved overall performance
Potential Commercial Applications
The potential commercial applications of this technology can be seen in:
- Consumer electronics
- Telecommunications
- Automotive industry
Possible Prior Art
One possible prior art related to this technology is the use of flip-chip technology in semiconductor packaging to improve electrical connections and signal integrity.
Unanswered Questions
How does this technology impact the overall size of the semiconductor device?
The abstract does not provide information on whether this technology affects the size of the semiconductor device.
What are the specific materials used for the conductive bump and contact in this technology?
The abstract does not mention the materials used for the conductive bump and contact in the semiconductor device.
Original Abstract Submitted
a semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. the conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85�, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.
