Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Hao-Lin Yang of Kaohsiung CIty (TW)

Kuan-Chieh Huang of Hsinchu City (TW)

Wei-Cheng Hsu of Kaohsiung City (TW)

Tzu-Jui Wang of Fengshan City (TW)

Ching-Chun Wang of Tainan (TW)

Hsiao-Hui Tseng of Tainan CIty (TW)

Chen-Jong Wang of Hsin-Chu (TW)

Dun-Nian Yaung of Taipei City (TW)

CRUCIFORM BONDING STRUCTURE FOR 3D-IC - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128216 titled 'CRUCIFORM BONDING STRUCTURE FOR 3D-IC

Simplified Explanation

The bonding structure described in the patent application involves using oblong bonding pads on two substrates to form 3D-IC devices. The pads are laid crosswise and bonded together, with one pad wider in one cross-section and the other wider in a perpendicular cross-section. This design reduces variations in bonding area due to alignment shifts and minimizes capacitive coupling between the pads and nearby wires.

• Explanation of the patent/innovation:

 * Formation of 3D-IC devices using oblong bonding pads on two substrates
 * Pads laid crosswise and bonded together
 * Pads have different widths in different cross-sections
 * Reduces variations in bonding area and minimizes capacitive coupling

1. 1. 1. Potential Applications:

- Advanced semiconductor devices - High-density integrated circuits

1. 1. 1. Problems Solved:

- Variations in bonding area due to alignment shifts - Capacitive coupling between bonding pads and nearby wires

1. 1. 1. Benefits:

- Improved reliability and performance of 3D-IC devices - Enhanced signal integrity in high-speed applications

1. 1. 1. Potential Commercial Applications:
         1. Optimizing 3D-IC Device Manufacturing for Enhanced Performance

1. 1. 1. Possible Prior Art:

- Previous methods of bonding pads on substrates for 3D-IC devices - Techniques for reducing variations in bonding area in semiconductor manufacturing

1. 1. 1. 1. Unanswered Questions:
         2. How does the oblong shape of the bonding pads specifically reduce capacitive coupling?

The oblong shape of the bonding pads helps to increase the distance between the pads and nearby wires, reducing the likelihood of capacitive coupling. This design minimizes the overlap area between the pads and adjacent conductive elements, thereby decreasing the capacitance between them.

1. 1. 1. 1. What are the specific challenges in aligning and bonding oblong pads on different substrates?

Aligning and bonding oblong pads on different substrates can be challenging due to the need for precise alignment in multiple dimensions. Ensuring that the pads are correctly oriented and positioned relative to each other is crucial to achieving a strong and reliable bond. Additionally, variations in substrate materials and surface topographies can impact the bonding process, requiring careful optimization of bonding parameters.

Original Abstract Submitted

a bonding structure that may be used to form 3d-ic devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. the first and second oblong bonding pads are laid crosswise, and the bond is formed. viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. the oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.