Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chih-Wei Wu of Zhuangwei Township (TW)

An-Jhih Su of Taoyuan City (TW)

Hua-Wei Tseng of New Taipei City (TW)

Ying-Ching Shih of Hsinchu City (TW)

Wen-Chih Chiou of Zhunan Township (TW)

Chun-Wei Chen of New Taipei City (TW)

Ming Shih Yeh of Zhubei City (TW)

Wei-Cheng Wu of Hsinchu City (TW)

Der-Chyang Yeh of Hsin-Chu (TW)

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128211 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

Simplified Explanation

The abstract describes a patent application for a stacked semiconductor die package, which includes an upper semiconductor die package above a lower semiconductor die package. The package includes pad structures within the footprint of the lower semiconductor die, used to mount the upper semiconductor die package. The size of the package may be reduced compared to other stacked semiconductor die packages.

• Techniques and apparatuses for a stacked semiconductor die package
• Upper semiconductor die package above a lower semiconductor die package
• Pad structures within the footprint of the lower semiconductor die
• Used to mount the upper semiconductor die package
• Size reduction compared to other stacked semiconductor die packages

Potential Applications

The technology described in this patent application could be applied in the semiconductor industry for the development of compact and efficient stacked semiconductor die packages.

Problems Solved

This technology solves the problem of efficiently stacking semiconductor die packages while reducing the overall size of the package.

Benefits

The benefits of this technology include increased efficiency in semiconductor packaging, reduced size of stacked packages, and potentially lower production costs.

Potential Commercial Applications

• Compact and efficient semiconductor packaging technology for various electronic devices

Possible Prior Art

One possible prior art for this technology could be the development of stacked semiconductor die packages with similar mounting structures, but without the specific size reduction features described in this patent application.

Unanswered Questions

How does this technology impact the overall performance of the semiconductor devices?

The abstract does not provide information on how the size reduction of the stacked semiconductor die package may affect the performance of the semiconductor devices. Further details on this aspect would be beneficial for a comprehensive understanding of the technology.

Are there any specific manufacturing processes required for implementing this technology?

The abstract does not mention any specific manufacturing processes involved in implementing the stacked semiconductor die package. Understanding the manufacturing requirements would be essential for assessing the feasibility and scalability of this technology.

Original Abstract Submitted

some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. the stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. the stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. the one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.