Taiwan semiconductor manufacturing co., ltd. (20240128148). Integrated Circuit Packages and Methods of Forming the Same simplified abstract

Integrated Circuit Packages and Methods of Forming the Same

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chang-Jung Hsueh of Taipei (TW)

Po-Yao Lin of Zhudong Township (TW)

Hui-Min Huang of Taoyuan City (TW)

Ming-Da Cheng of Taoyuan City (TW)

Kathy Yan of Hsinchu (TW)

Integrated Circuit Packages and Methods of Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128148 titled 'Integrated Circuit Packages and Methods of Forming the Same

Simplified Explanation

The method described in the patent application involves attaching a package component to a package substrate, where the package component includes an interposer, a first die, and a second die. A first thermal interface material is attached to the first die, composed of a first material, while a second thermal interface material is attached to the second die, composed of a second material different from the first material. Finally, a lid assembly is attached to the package substrate, connected to both the first and second thermal interface materials.

• Interposer, first die, and second die are attached to the package substrate.
• First thermal interface material is attached to the first die, composed of a first material.
• Second thermal interface material is attached to the second die, composed of a second material different from the first material.
• Lid assembly is attached to the package substrate, connected to both the first and second thermal interface materials.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as computers, smartphones, and other gadgets that require efficient heat dissipation.

Problems Solved

This technology helps in improving thermal management in electronic devices by using different thermal interface materials for different components, ensuring optimal heat transfer and dissipation.

Benefits

The use of different thermal interface materials for different components helps in enhancing the overall thermal performance of electronic devices, leading to better reliability and longevity.

Potential Commercial Applications

One potential commercial application of this technology could be in the production of high-performance computing devices where thermal management is crucial for optimal operation and longevity.

Possible Prior Art

One possible prior art could be the use of thermal interface materials in electronic devices to improve heat dissipation and thermal performance.

How does the choice of different thermal interface materials impact the overall thermal performance of the electronic device?

The article does not delve into the specific effects of using different thermal interface materials on the overall thermal performance of the electronic device.

What are the specific characteristics of the first and second materials used in the thermal interface materials?

The article does not provide details on the specific characteristics of the first and second materials used in the thermal interface materials.

Original Abstract Submitted

a method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.