Taiwan semiconductor manufacturing co., ltd. (20240128120). PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract
Contents
- 1 PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hsiang-Wei Liu of Tainan City (TW)
Chung-Kuang Lin of Hsinchu City (TW)
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128120 titled 'PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Simplified Explanation
The abstract describes a package structure and manufacturing method involving a semiconductor die, redistribution layer, and connectors. The connectors electrically connect the semiconductor die and redistribution layer, with the redistribution layer consisting of a dielectric layer with an opening and a metallic pattern layer.
- The package structure includes at least one semiconductor die, a redistribution layer, and connectors.
- Connectors are located between the semiconductor die and redistribution layer, facilitating electrical connection.
- The redistribution layer comprises a dielectric layer with an opening and a metallic pattern layer.
- The metallic pattern layer contains a metallic via within the opening, surrounded by a dielectric spacer.
Potential Applications
This technology could be applied in the manufacturing of advanced electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This innovation solves the problem of efficiently connecting semiconductor dies to redistribution layers in electronic packages.
Benefits
The benefits of this technology include improved electrical connectivity, enhanced performance, and potentially reduced manufacturing costs.
Potential Commercial Applications
A potential commercial application for this technology could be in the semiconductor industry for the production of high-performance electronic devices.
Possible Prior Art
One possible prior art could be the use of traditional wire bonding techniques in semiconductor packaging.
Unanswered Questions
How does this technology compare to existing packaging methods in terms of cost-effectiveness?
This article does not provide a direct comparison with existing packaging methods in terms of cost-effectiveness. Further research or data analysis would be needed to address this question.
What impact does the dielectric spacer have on the overall performance of the package structure?
The article does not delve into the specific impact of the dielectric spacer on the overall performance of the package structure. Additional testing or analysis would be required to answer this question accurately.
Original Abstract Submitted
a package structure and a manufacturing method thereof are disclosed. the structure includes at least one semiconductor die, a redistribution layer disposed on the at least one semiconductor die, and connectors there-between. the connectors are disposed between the at least one semiconductor die and the redistribution layer, and electrically connect the at least one semiconductor die and the redistribution layer. the redistribution layer includes a dielectric layer with an opening and a metallic pattern layer disposed on the dielectric layer, and the metallic pattern layer includes a metallic via located inside the opening with a dielectric spacer surrounding the metallic via and located between the metallic via and the opening.
