Taiwan semiconductor manufacturing co., ltd. (20240126170). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION simplified abstract

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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chun-Chih Ho of Taichung City (TW)

Chin-Hsiang Lin of Hsinchu (TW)

Ching-Yu Chang of Yuansun Village (TW)

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240126170 titled 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION

Simplified Explanation

The patent application describes a method of manufacturing a semiconductor device using a photoresist composition with photocleaving promoters.

  • The photoresist layer is formed over a substrate.
  • The photoresist layer is selectively exposed to actinic radiation.
  • The exposed photoresist layer is developed to form a pattern.
  • The photoresist composition includes a polymer with monomer units containing photocleaving promoters.

Potential Applications

This technology can be applied in the manufacturing of semiconductor devices, integrated circuits, and other electronic components that require precise patterning.

Problems Solved

This technology helps in achieving high-resolution patterning in semiconductor devices, improving their performance and functionality.

Benefits

The use of photocleaving promoters in the photoresist composition allows for precise and efficient patterning, leading to enhanced device performance and reliability.

Potential Commercial Applications

"Enhancing Semiconductor Device Patterning with Photocleaving Promoters"

Possible Prior Art

Prior art may include patents or publications related to photoresist compositions with photocleaving promoters for semiconductor device manufacturing.

Unanswered Questions

How does this method compare to traditional semiconductor device manufacturing processes?

This method may offer improved resolution and efficiency compared to traditional processes, but further comparative studies are needed to fully understand its advantages.

What are the potential limitations or challenges of implementing this technology on an industrial scale?

Scaling up this technology for mass production may pose challenges in terms of cost, compatibility with existing manufacturing processes, and overall efficiency.


Original Abstract Submitted

a method of manufacturing a semiconductor device includes forming a photoresist layer including a photoresist composition over a substrate. the photoresist layer is selectively exposed to actinic radiation, the selectively exposed photoresist layer is developed to form a pattern in the photoresist layer. the photoresist composition includes a polymer including monomer units with photocleaving promoters, wherein the photocleaving promoters are one or more selected from the group consisting of living free radical polymerization chain transfer agents, electron withdrawing groups, bulky two dimensional (2-d) or three dimensional (3-d) organic groups, n-(acyloxy)phthalimides, and electron stimulated radical generators.