Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Wen-Shiang Liao of Miaoli County (TW)
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128196 titled 'SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
Simplified Explanation
The semiconductor structure described in the abstract includes a substrate, a first conductive layer, a chip, a first dielectric layer, a second conductive layer, first vias, and second vias. The first and second vias are arranged in a staggered fashion in different directions.
- The semiconductor structure includes:
- Substrate
- First conductive layer
- Chip
- First dielectric layer
- Second conductive layer
- Plurality of first vias
- Plurality of second vias
- Vias arranged in a staggered fashion
Potential Applications
The semiconductor structure can be used in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
Problems Solved
This technology helps in improving the electrical connectivity and insulation in semiconductor devices, leading to better performance and reliability.
Benefits
The semiconductor structure offers enhanced electrical connections, improved signal transmission, and increased efficiency in electronic devices.
Potential Commercial Applications
The semiconductor structure can be utilized in the semiconductor industry for manufacturing advanced electronic components with improved functionality and performance.
Possible Prior Art
One possible prior art could be the use of vias in semiconductor structures for electrical connections and insulation purposes.
Unanswered Questions
How does this semiconductor structure compare to traditional semiconductor structures in terms of performance and reliability?
The article does not provide a direct comparison between this semiconductor structure and traditional structures in terms of performance and reliability.
What are the specific manufacturing processes involved in creating this semiconductor structure?
The article does not delve into the specific manufacturing processes involved in creating this semiconductor structure.
Original Abstract Submitted
a semiconductor structure is provided. the semiconductor structure includes a substrate, a first conductive layer formed on the substrate, a chip disposed on the substrate, a first dielectric layer surrounding the chip, a second conductive layer disposed on the first dielectric layer and electrically insulated from the first conductive layer, a plurality of first vias formed in the first dielectric layer and electrically connected to the first conductive layer, and a plurality of second vias formed in the first dielectric layer and electrically connected to the second conductive layer. the first vias are arranged in a first direction. the second vias are arranged in the first direction, and the first vias and the second vias are arranged in a staggered fashion in a second direction, which is different from the first direction.
