Taiwan semiconductor manufacturing co., ltd. (20240096816). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Jing-Cheng Lin of Hsinchu (TW)
Po-Hao Tsai of Taoyuan City (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096816 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Simplified Explanation
The abstract describes a semiconductor device with a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark formed from characters that are either cross-free or have an overlap count of less than two. The mark may also be formed using a wobble scan methodology to reduce or eliminate defects from the marking process.
- Conductive via laterally separated from semiconductor
- Encapsulant between semiconductor device and conductive via
- Mark formed from characters that are cross-free or have an overlap count of less than two
- Mark may be formed using a wobble scan methodology
Potential Applications
This technology could be applied in the semiconductor industry for marking and identifying specific devices or components.
Problems Solved
This technology helps reduce or eliminate defects that may occur during the marking process in semiconductor devices.
Benefits
The use of cross-free characters or characters with a low overlap count, as well as the wobble scan methodology, can improve the quality and reliability of markings on semiconductor devices.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor manufacturing companies looking to improve the marking process for their devices.
Possible Prior Art
Prior art in the semiconductor industry may include methods for marking semiconductor devices, but the specific use of cross-free characters or characters with a low overlap count, as well as the wobble scan methodology, may be novel.
Unanswered Questions
How does this technology compare to existing methods of marking semiconductor devices?
This article does not provide a direct comparison to existing methods of marking semiconductor devices, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the potential limitations or challenges of implementing this technology in semiconductor manufacturing processes?
The article does not address any potential limitations or challenges that may arise when implementing this technology in semiconductor manufacturing processes, leaving room for further exploration of practical considerations.
Original Abstract Submitted
a semiconductor device has a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. the mark is formed from characters that are either cross-free characters or else have a overlap count of less than two. in another embodiment the mark is formed using a wobble scan methodology. by forming marks as described, defects from the marking process may be reduced or eliminated.
