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• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
  .../66]] (42), [[:Category:H01L29/78|H01L29/78]] (27), [[:Category:H01L21/768|H01L21/768]] (21), [[:Category:H01L29/06|H01L29/06]] (20), [[:Category:H01L29/6679 IPC Code(s): B32B38/18, H01L23/00, H01L21/48
  99 KB (12,848 words) - 09:00, 30 January 2024
• Patent Applications Report for 28th Apr 2023
  ...[[:Category:H01L21/67|H01L21/67]] (7 applications), [[:Category:H01L21/02|H01L21/02]] (5 applications), [[:Category:H01J37/08|H01J37/08]] (4 applications), ...:Category:H04L41/342|H04L41/342]] (2 applications), [[:Category:H01L21/266|H01L21/266]] (2 applications)
  35 KB (4,354 words) - 01:42, 3 January 2024
• Blockchain patent applications on March 14th, 2024
  IPC Code(s): H01L21/02, H01L21/3205, H01L21/321, H01L21/3213 ...egory:H01L21/02]][[Category:H01L21/3205]][[Category:H01L21/321]][[Category:H01L21/3213]][[Category:Microchip Technology Incorporated]]
  369 KB (52,527 words) - 02:32, 20 March 2024