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Bibliographic details for US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract
- Page name: US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 5 December 2023 05:48 UTC
- Date retrieved: 19 May 2024 16:56 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871
- Page Version ID: 12871
Citation styles for US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract
APA style
US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract. (2023, December 5). WikiPatents, . Retrieved 16:56, May 19, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871.
MLA style
"US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract." WikiPatents, . 5 Dec 2023, 05:48 UTC. 19 May 2024, 16:56 <http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871>.
MHRA style
WikiPatents contributors, 'US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract', WikiPatents, , 5 December 2023, 05:48 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871> [accessed 19 May 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871 (accessed May 19, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract [Internet]. WikiPatents, ; 2023 Dec 5, 05:48 UTC [cited 2024 May 19]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871.
Bluebook style
US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871 (last visited May 19, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871",
note = "[Online; accessed 19-May-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18132437._WAFER_LEVEL_CHIP_SCALE_PACKAGE_WITH_SIDEWALL_PROTECTION_simplified_abstract&oldid=12871}",
note = "[Online; accessed 19-May-2024]"
}
