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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract
- Page name: Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 26 April 2024 04:06 UTC
- Date retrieved: 19 May 2024 12:05 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741
- Page Version ID: 56741
Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract
APA style
Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract. (2024, April 26). WikiPatents, . Retrieved 12:05, May 19, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741.
MLA style
"Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract." WikiPatents, . 26 Apr 2024, 04:06 UTC. 19 May 2024, 12:05 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741>.
MHRA style
WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract', WikiPatents, , 26 April 2024, 04:06 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741> [accessed 19 May 2024]
Chicago style
WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741 (accessed May 19, 2024).
CBE/CSE style
WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 04:06 UTC [cited 2024 May 19]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741.
Bluebook style
Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741 (last visited May 19, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741",
note = "[Online; accessed 19-May-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128216)._CRUCIFORM_BONDING_STRUCTURE_FOR_3D-IC_simplified_abstract&oldid=56741}",
note = "[Online; accessed 19-May-2024]"
}
