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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract

Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract

APA style

Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract. (2024, April 26). WikiPatents, . Retrieved 09:25, May 28, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739.

MLA style

"Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract." WikiPatents, . 26 Apr 2024, 04:06 UTC. 28 May 2024, 09:25 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract', WikiPatents, , 26 April 2024, 04:06 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739> [accessed 28 May 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739 (accessed May 28, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 04:06 UTC [cited 2024 May 28]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739.

Bluebook style

Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739 (last visited May 28, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739",
   note = "[Online; accessed 28-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240128211)._SEMICONDUCTOR_DIE_PACKAGE_AND_METHODS_OF_MANUFACTURING_simplified_abstract&oldid=56739}",
   note = "[Online; accessed 28-May-2024]"
 }


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