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Bibliographic details for Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract

Citation styles for Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract

APA style

Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract. (2024, March 21). WikiPatents, . Retrieved 14:29, May 19, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345.

MLA style

"Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract." WikiPatents, . 21 Mar 2024, 10:10 UTC. 19 May 2024, 14:29 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract', WikiPatents, , 21 March 2024, 10:10 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345> [accessed 19 May 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345 (accessed May 19, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract [Internet]. WikiPatents, ; 2024 Mar 21, 10:10 UTC [cited 2024 May 19]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345.

Bluebook style

Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345 (last visited May 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345",
   note = "[Online; accessed 19-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing co., ltd. (20240096830). Adding Sealing Material to Wafer edge for Wafer Bonding simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_co.,_ltd._(20240096830)._Adding_Sealing_Material_to_Wafer_edge_for_Wafer_Bonding_simplified_abstract&oldid=40345}",
   note = "[Online; accessed 19-May-2024]"
 }


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