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Bibliographic details for THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)

Citation styles for THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)

APA style

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394). (2023, October 1). WikiPatents, . Retrieved 05:26, May 12, 2024 from http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371.

MLA style

"THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)." WikiPatents, . 1 Oct 2023, 16:13 UTC. 12 May 2024, 05:26 <http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371>.

MHRA style

WikiPatents contributors, 'THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)', WikiPatents, , 1 October 2023, 16:13 UTC, <http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371> [accessed 12 May 2024]

Chicago style

WikiPatents contributors, "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)," WikiPatents, , http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371 (accessed May 12, 2024).

CBE/CSE style

WikiPatents contributors. THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) [Internet]. WikiPatents, ; 2023 Oct 1, 16:13 UTC [cited 2024 May 12]. Available from: http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371.

Bluebook style

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394), http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371 (last visited May 12, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371",
   note = "[Online; accessed 12-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=THREE-DIMENSIONAL_(3D)_INTEGRATED_CIRCUIT_(IC)_(3DIC)_PACKAGE_WITH_A_BOTTOM_DIE_LAYER_EMPLOYING_AN_EXTENDED_INTERPOSER_SUBSTRATE,_AND_RELATED_FABRICATION_METHODS:_abstract_simplified_(17655394)&oldid=371}",
   note = "[Online; accessed 12-May-2024]"
 }


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