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Bibliographic details for Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract

Citation styles for Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract

APA style

Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract. (2024, April 26). WikiPatents, . Retrieved 22:56, May 18, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380.

MLA style

"Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract." WikiPatents, . 26 Apr 2024, 02:33 UTC. 18 May 2024, 22:56 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract', WikiPatents, , 26 April 2024, 02:33 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380> [accessed 18 May 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380 (accessed May 18, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 02:33 UTC [cited 2024 May 18]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380.

Bluebook style

Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380 (last visited May 18, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380",
   note = "[Online; accessed 18-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240136264)._FAN-OUT_SEMICONDUCTOR_PACKAGE_AND_METHOD_OF_MANUFACTURING_THE_FAN-OUT_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=55380}",
   note = "[Online; accessed 18-May-2024]"
 }


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