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Bibliographic details for Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract

Citation styles for Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract

APA style

Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract. (2024, April 26). WikiPatents, . Retrieved 08:17, May 19, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584.

MLA style

"Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract." WikiPatents, . 26 Apr 2024, 03:56 UTC. 19 May 2024, 08:17 <http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract', WikiPatents, , 26 April 2024, 03:56 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584> [accessed 19 May 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584 (accessed May 19, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 03:56 UTC [cited 2024 May 19]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584.

Bluebook style

Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584 (last visited May 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584",
   note = "[Online; accessed 19-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240136244). IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240136244)._IC_DIE_AND_HEAT_SPREADERS_WITH_SOLDERABLE_THERMAL_INTERFACE_STRUCTURES_FOR_MULTI-CHIP_ASSEMBLIES_INCLUDING_SOLDER_ARRAY_THERMAL_INTERCONNECTS_simplified_abstract&oldid=56584}",
   note = "[Online; accessed 19-May-2024]"
 }


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