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Bibliographic details for Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract

Citation styles for Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract

APA style

Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract. (2024, April 26). WikiPatents, . Retrieved 07:16, May 25, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582.

MLA style

"Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract." WikiPatents, . 26 Apr 2024, 02:47 UTC. 25 May 2024, 07:16 <http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract', WikiPatents, , 26 April 2024, 02:47 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582> [accessed 25 May 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582 (accessed May 25, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 02:47 UTC [cited 2024 May 25]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582.

Bluebook style

Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582 (last visited May 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582",
   note = "[Online; accessed 25-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240128223)._ASSEMBLY_OF_2XD_MODULE_USING_HIGH_DENSITY_INTERCONNECT_BRIDGES_simplified_abstract&oldid=55582}",
   note = "[Online; accessed 25-May-2024]"
 }


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