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Bibliographic details for Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract

Citation styles for Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract

APA style

Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract. (2024, April 26). WikiPatents, . Retrieved 18:10, May 24, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578.

MLA style

"Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract." WikiPatents, . 26 Apr 2024, 02:47 UTC. 24 May 2024, 18:10 <http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract', WikiPatents, , 26 April 2024, 02:47 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578> [accessed 24 May 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578 (accessed May 24, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract [Internet]. WikiPatents, ; 2024 Apr 26, 02:47 UTC [cited 2024 May 24]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578.

Bluebook style

Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578 (last visited May 24, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578",
   note = "[Online; accessed 24-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240128202)._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract&oldid=55578}",
   note = "[Online; accessed 24-May-2024]"
 }


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