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Bibliographic details for Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract

Citation styles for Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract

APA style

Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract. (2024, April 11). WikiPatents, . Retrieved 07:12, May 17, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600.

MLA style

"Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract." WikiPatents, . 11 Apr 2024, 04:08 UTC. 17 May 2024, 07:12 <http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract', WikiPatents, , 11 April 2024, 04:08 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600> [accessed 17 May 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600 (accessed May 17, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract [Internet]. WikiPatents, ; 2024 Apr 11, 04:08 UTC [cited 2024 May 17]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600.

Bluebook style

Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600 (last visited May 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600",
   note = "[Online; accessed 17-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240113000)._DUAL_SIDED_EMBEDDED_PASSIVES_VIA_PANEL_LEVEL_THERMAL_COMPRESSION_BONDING_simplified_abstract&oldid=47600}",
   note = "[Online; accessed 17-May-2024]"
 }


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