Cite This Page

Jump to navigation Jump to search

Bibliographic details for 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)

Citation styles for 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)

APA style

18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.). (2023, December 11). WikiPatents, . Retrieved 23:30, May 16, 2024 from http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862.

MLA style

"18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 11 Dec 2023, 06:04 UTC. 16 May 2024, 23:30 <http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862>.

MHRA style

WikiPatents contributors, '18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 11 December 2023, 06:04 UTC, <http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862> [accessed 16 May 2024]

Chicago style

WikiPatents contributors, "18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862 (accessed May 16, 2024).

CBE/CSE style

WikiPatents contributors. 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2023 Dec 11, 06:04 UTC [cited 2024 May 16]. Available from: http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862.

Bluebook style

18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862 (last visited May 16, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862",
   note = "[Online; accessed 16-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862}",
   note = "[Online; accessed 16-May-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"