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Bibliographic details for 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)

Citation styles for 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)

APA style

18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation). (2024, April 26). WikiPatents, . Retrieved 04:50, May 19, 2024 from http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182.

MLA style

"18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)." WikiPatents, . 26 Apr 2024, 06:03 UTC. 19 May 2024, 04:50 <http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182>.

MHRA style

WikiPatents contributors, '18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)', WikiPatents, , 26 April 2024, 06:03 UTC, <http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182> [accessed 19 May 2024]

Chicago style

WikiPatents contributors, "18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182 (accessed May 19, 2024).

CBE/CSE style

WikiPatents contributors. 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Apr 26, 06:03 UTC [cited 2024 May 19]. Available from: http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182.

Bluebook style

18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182 (last visited May 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182",
   note = "[Online; accessed 19-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18397898._METHOD_TO_IMPLEMENT_WAFER-LEVEL_CHIP-SCALE_PACKAGES_WITH_GROUNDED_CONFORMAL_SHIELD_simplified_abstract_(Intel_Corporation)&oldid=58182}",
   note = "[Online; accessed 19-May-2024]"
 }


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