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Bibliographic details for 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

APA style

18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.). (2024, April 26). WikiPatents, . Retrieved 10:55, May 19, 2024 from http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088.

MLA style

"18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 26 Apr 2024, 04:29 UTC. 19 May 2024, 10:55 <http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088>.

MHRA style

WikiPatents contributors, '18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 26 April 2024, 04:29 UTC, <http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088> [accessed 19 May 2024]

Chicago style

WikiPatents contributors, "18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088 (accessed May 19, 2024).

CBE/CSE style

WikiPatents contributors. 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Apr 26, 04:29 UTC [cited 2024 May 19]. Available from: http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088.

Bluebook style

18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088 (last visited May 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088",
   note = "[Online; accessed 19-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18204241._METHOD_OF_MANUFACTURING_SEMICONDUCTOR_PACKAGE,_AND_SEMICONDUCTOR_PACKAGE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=57088}",
   note = "[Online; accessed 19-May-2024]"
 }


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