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Citation styles for 17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 19:09, May 11, 2024 from http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968.

MLA style

"17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 11:07 UTC. 11 May 2024, 19:09 <http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968>.

MHRA style

WikiPatents contributors, '17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 11:07 UTC, <http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968> [accessed 11 May 2024]

Chicago style

WikiPatents contributors, "17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968 (accessed May 11, 2024).

CBE/CSE style

WikiPatents contributors. 17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 11:07 UTC [cited 2024 May 11]. Available from: http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968.

Bluebook style

17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968 (last visited May 11, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968",
   note = "[Online; accessed 11-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17740649. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND PROTECTIVE FILM USED THEREFOR simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17740649._METHOD_FOR_MANUFACTURING_SEMICONDUCTOR_PACKAGE_AND_PROTECTIVE_FILM_USED_THEREFOR_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20968}",
   note = "[Online; accessed 11-May-2024]"
 }