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Bibliographic details for 17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 02:15, May 13, 2024 from http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905.

MLA style

"17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 06:27 UTC. 13 May 2024, 02:15 <http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905>.

MHRA style

WikiPatents contributors, '17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 06:27 UTC, <http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905> [accessed 13 May 2024]

Chicago style

WikiPatents contributors, "17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905 (accessed May 13, 2024).

CBE/CSE style

WikiPatents contributors. 17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 06:27 UTC [cited 2024 May 13]. Available from: http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905.

Bluebook style

17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905 (last visited May 13, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905",
   note = "[Online; accessed 13-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17722838._WAFER_PROCESSING_APPARATUS_INCLUDING_EFEM_AND_METHOD_OF_PROCESSING_WAFER_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20905}",
   note = "[Online; accessed 13-May-2024]"
 }


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