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Bibliographic details for 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 04:55, May 10, 2024 from http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198.

MLA style

"17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 04:26 UTC. 10 May 2024, 04:55 <http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198>.

MHRA style

WikiPatents contributors, '17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 04:26 UTC, <http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198> [accessed 10 May 2024]

Chicago style

WikiPatents contributors, "17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198 (accessed May 10, 2024).

CBE/CSE style

WikiPatents contributors. 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 04:26 UTC [cited 2024 May 10]. Available from: http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198.

Bluebook style

17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198 (last visited May 10, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198",
   note = "[Online; accessed 10-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17702440._SEMICONDUCTOR_PACKAGE_INCLUDING_HEAT_DISSIPATION_STRUCTURE_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20198}",
   note = "[Online; accessed 10-May-2024]"
 }


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